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A three-dimensional thermal analysis and optimization of square light edding diode subcomponents

Ben Hamida M.B. Chemical Engineering Department, College of Engineering, Ha'il University, Ha'il City, Saudi Arabia|
Chamkha A. Department of Mechanical Engineering, College of Engineering, Al Imam Mohammad Ibn Saud Islamic University, Riyadh, 11432, Saudi Arabia| Almeshaal M.A. Higher School of Sciences and Technology of Hammam Sousse (ESSTHS), Physics Department, University of Sousse, Lamine Abassi Street, Sousse, 4011, Tunisia| Charrada K. Research Unit of Ionized Backgrounds and Reagents Studies (UEMIR), Preparatory Institute for Engineering Studies of Monastir (IPEIM), University of Monastir, 5019 Kairouan street, Tunisia|

International Communications in Heat and Mass Transfer Số , năm 2020 (Tập , trang -)

ISSN: 7351933

ISSN: 7351933

DOI: 10.1016/j.icheatmasstransfer.2020.105016

Tài liệu thuộc danh mục: Scopus

Article

English

Từ khóa: Codes (symbols); Dies; Heat sinks; Light emitting diodes; Metallizing; Thermoanalysis; Comsol multiphysics; Device reliability; Junction temperatures; Single chips; Systems of equations; Thermal characterization; Thermal interface materials; Three dimensional code; Thermal management (electronics)
Tóm tắt tiếng anh
The purpose of this paper is to assess thermal management and optimization of several parameters such as: materials, size and thickness of all subcomponents of single-chip Light Emitting Diode (LED) in order to minimize its junction temperature and thereby maximizing light output and device reliability. For this, we developed a three-dimensional code using Comsol Multiphysics that solves the systems of equations for the mass, momentum and energy. After validation of this numerical 3D code, the thermal Characterization of Subcomponents of LED system is studied numerically. This system is divided into 6 parts such as: metallization, die, die-attach, substrate, Thermal Interface Material and heat sink. Several materials which can be used in each part of the LED package from metallization to the heat sink are studied. By moving to one part to another, it was selected the best materials always allowing a minimum junction temperature. � 2020

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